Laser Assisted Bonding with LaPlace by PacTech | Advanced Packaging Equipment
Автор: PacTech GmbH
Загружено: 2022-05-02
Просмотров: 9906
Описание:
Using localized laser heating mechanism, temperature can be applied selectively in the interconnection areas of interest without heating up the entire substrate up to the reflow temperature to liquefy and reflow an interconnection of a few microns. With customized bond tool and laser technology, pick-and-place and assembly reflow heating are accomplished in single step at high accuracy smaller then 5µm. Localized heat ensures reliable bonding of large dies while the in-situ reflow supports ultra-small die assembly as small as 300µm.
Our unique temperature control mechanism protects single chip or component from being over-heated and prevents substrate from warpage and repeating reflow circumstances.
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![[Eng Sub] Flipchip die attach process: Bump, MR(Mass Reflow), TCNCP, LAB(Laser Assist Bond), NCP](https://image.4k-video.ru/id-video/Yr_1vcYdbvI)
