ycliper

Популярное

Музыка Кино и Анимация Автомобили Животные Спорт Путешествия Игры Юмор

Интересные видео

2025 Сериалы Трейлеры Новости Как сделать Видеоуроки Diy своими руками

Топ запросов

смотреть а4 schoolboy runaway турецкий сериал смотреть мультфильмы эдисон
Скачать

Packaging Part 5 - Manufacturing process

Автор: Navid Asadi

Загружено: 2021-02-19

Просмотров: 30732

Описание: References:
[1] AMD's CEO: WAFER supply is TIGHT, customer visibility is crucial. (2020, January 29). Retrieved March 01, 2021, from https://www.cbronline.com/boardroom/a...
[2] Cohen, Z. (2019, October 29). 3D printing Integrated Circuits: What's possible now and in the future? Retrieved March 01, 2021, from https://www.nano-di.com/blog/2019-3d-...
[3] Protected chip pic18f6525 heximal reading from its flash. (2019, June 26). Retrieved March 01, 2021
[4] Hesse Mechatronics, Hesse Mechatronics to Demonstrate wedge wire Bonding capabilities at Productronica. (2013, October 31). Retrieved March 02, 2021, from https://smtnet.com/news/index.cfm?fus...
[5] Tsai, Jinn-Tsong & Chang, Cheng-Chung & Chen, Wen-Ping & Chou, Jyh-Horng. (2016). Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method. IEEE Access. 4. 1-1. 10.1109/ACCESS.2016.2581258.
[6] Media ATN. (2021, February 12). Flip chip assembly: Alter Technology (formerly optocap),. Retrieved March 02, 2021, from https://wpo-altertechnology.com/flip-...
[7] FlipChip package overview. (2017, November 26). Retrieved March 02, 2021, from https://anysilicon.com/flipchip-packa...
[8] S. (2011, October 27). 3D Thursday: Generation-jumping 2.5D xilinx Virtex-7 2000T FPGA DELIVERS 1,954,560 logic cells USING 6.8 billion transistors (UPDATED!). Retrieved March 02, 2021, from https://eda360insider.wordpress.com/2...
[9] D. (2020, October 30). Global interposer MARKET 2020 Industry key player – Murata, ALLVIA, Inc, tezzaron, AGC Electronics, Tsmc, XILINX, Amkor, umc, IMT, Plan Optik AG,. Retrieved March 02, 2021, from https://bcfocus.com/global-interposer...
[10] Accelonix. (n.d.). Wirebonding services. Retrieved March 02, 2021, from https://accelonix.co.uk/service-and-s...
[11] Clive Max Maxfield, Chapter 19 - Hybrids, Editor(s): Clive Max Maxfield, Bebop to the Boolean Boogie (Third Edition), Newnes, 2009, Pages 277-292, ISBN 9781856175074, https://doi.org/10.1016/B978-1-85617-.... (https://www.sciencedirect.com/science...)
[12] Gold and aluminum wire bonding. (2020, September 28). Retrieved March 02, 2021, from https://www.we-online.com/web/en/leit...
[13] Joram, C. (2002, November 1). Basics of wire bonding. Retrieved March 02, 2021, from https://ssd-rd.web.cern.ch/dsf/bond_l...
[14] HYBOND, Inc. - about wire bonding. (n.d.). Retrieved March 02, 2021, from http://www.hybond.com/pages/wirebond-...
[15] Paquet, M., Dufort, C., Lombardi, T., Sinha, T., Hasegawa, M., Okoshi, K., & Kohara, K. (2016). Effect of Underfill Formulation on Large-Die, Flip-Chip Organic Package Reliability: A Systematic Study on Compositional and Assembly Process Variations. 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 729-736.
[16]Twisp. (2021, March 01). Flip chip. Retrieved March 02, 2021, from https://en.wikipedia.org/wiki/Flip_chip
[17] C. Chien et al., "Performance and process characteristic of glass interposer with through-glass-via(TGV)," 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, 2013, pp. 1-7, doi: 10.1109/3DIC.2013.6702380.
[18] Saban, K. (2009). Xilinx Stacked Silicon Interconnect Technology Delivers Breakthrough FPGA Capacity , Bandwidth , and Power Efficiency.
[19] Lapedus, M. (2019, February 06). Bridges vs. INTERPOSERS. Retrieved March 02, 2021, from https://semiengineering.com/using-sil...
[20] Characterization of Through-Silicon VIAS for 3D integrated chips With EBSD. (2014, February 21). Retrieved March 02, 2021, from https://www.azonano.com/article.aspx?...
[21] P. A. Thadesar, X. Gu, R. Alapati and M. S. Bakir, "Through-Silicon Vias: Drivers, Performance, and Innovations," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 7, pp. 1007-1017, July 2016, doi: 10.1109/TCPMT.2016.2524691.
[22] Jun-Hsien Yeh, Tsung-Nan Tsai, Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method, Microelectronics Reliability, Volume 54, Issue 1, 2014, Pages 287-296, ISSN 0026-2714, https://doi.org/10.1016/j.microrel.20.... (https://www.sciencedirect.com/science...)
[23] Rønsberg, H. (2019, May 07). Using x-ray for Wire Bond Failure Analysis: DELTA MICROELECTRONICS. Retrieved March 02, 2021, from https://asic.presto-eng.com/portfolio...

Не удается загрузить Youtube-плеер. Проверьте блокировку Youtube в вашей сети.
Повторяем попытку...
Packaging Part 5 - Manufacturing process

Поделиться в:

Доступные форматы для скачивания:

Скачать видео

  • Информация по загрузке:

Скачать аудио

Похожие видео

Packaging Part 6 - Wafer to Panel Level Packaging

Packaging Part 6 - Wafer to Panel Level Packaging

Упаковка, часть 12 – Гибридное склеивание 1

Упаковка, часть 12 – Гибридное склеивание 1

Why Hybrid Bonding is the Future of Packaging

Why Hybrid Bonding is the Future of Packaging

Stacking Dies For Performance and Profit

Stacking Dies For Performance and Profit

Packaging Part 3 - Silicon Interposer

Packaging Part 3 - Silicon Interposer

INTRODUCTION TO FLIP CHIP TECHNOLOGY

INTRODUCTION TO FLIP CHIP TECHNOLOGY

Упаковка, часть 16 1 — Обзор кремниевой фотоники

Упаковка, часть 16 1 — Обзор кремниевой фотоники

2.5 D & 3D Chips: Interposers and Through Silicon Vias

2.5 D & 3D Chips: Interposers and Through Silicon Vias

Packaging part 7 -  System in Package

Packaging part 7 - System in Package

Multilayer PCB Manufacturing Process: Complete Step-by-Step Guide

Multilayer PCB Manufacturing Process: Complete Step-by-Step Guide

Упаковка Часть 4 - 2.5D и 3D

Упаковка Часть 4 - 2.5D и 3D

How It's Made: Multilayer PCB Manufacturing Insight

How It's Made: Multilayer PCB Manufacturing Insight

СОЕДИНЕНИЕ ПРОВОДОВ (ЧАСТЬ 1)

СОЕДИНЕНИЕ ПРОВОДОВ (ЧАСТЬ 1)

Честно про аддитивные технологии.

Честно про аддитивные технологии.

Выставка Потребительской Электроники США Инновации Патенты Интересно 2026

Выставка Потребительской Электроники США Инновации Патенты Интересно 2026

Wirebonding Overview Animation

Wirebonding Overview Animation

Путин хочет передать власть. Трампа пытаются сломать. Зачем блокируют телеграм? | Пастухов, Еловский

Путин хочет передать власть. Трампа пытаются сломать. Зачем блокируют телеграм? | Пастухов, Еловский

Packaging Part 1 - Traditional Packaging - Alonso Lopez

Packaging Part 1 - Traditional Packaging - Alonso Lopez

Packaging Part 2 - Introduction to IC Packaging

Packaging Part 2 - Introduction to IC Packaging

Электроконнект: как сделать печатные платы дешевле Китая?

Электроконнект: как сделать печатные платы дешевле Китая?

© 2025 ycliper. Все права защищены.



  • Контакты
  • О нас
  • Политика конфиденциальности



Контакты для правообладателей: [email protected]