S12 X-FAB Technologies: E3 Photonics at X-FAB: Enabling Scalable Innovation
Автор: Europractice Services
Загружено: 2026-02-05
Просмотров: 45
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This is Episode 3 in the Europractice webinar series on X-FAB technologies.
This webinar introduces X-FAB’s XPH90 SOI Silicon Photonics platform, engineered to meet the demands of next-generation optical connectivity applications, including datacom, telecom, LIDAR, AR/VR, and quantum computing.
Leveraging heterogeneous integration techniques such as Micro-Transfer printing, Die-to-Wafer and Wafer-to-Wafer bonding, XPH90 enables the incorporation of advanced materials (for example, III-V semiconductors, SiGe, lithium niobate, and others). This integration enhances performance and functionality while maintaining compatibility with CMOS manufacturing and packaging processes.
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