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SET - ACCµRA M Flip-Chip Bonder
Автор: SET Corporation
Загружено: 2022-12-22
Просмотров: 3021
Описание:
The ACCμRA M is a manual Flip-Chip Bonder permitting to reach ± 3 μm post-bond accuracy.
The only motorized axis is the arm, which controls precisely the bonding force.
Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.
The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.
It is the perfect equipment for universities and R&D institutes.
For more information, visit http://www.set-sas.fr
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