S-King Product: Flip Chip Die Bonder (High Precision Solution)

Автор: Aaron C

Загружено: 2023-10-12

Просмотров: 29393

Описание: Company: SHENZHEN SKING INTELLIGENT EQUIPMENT. CO., LTD
(stock code: 688328)

Sales Contact: [email protected]

S-King (Shenkeda Group), a OEM Equipment Maker to provide automation manufacturing and semiconductor solutions for Assembly&Testing

[CP]: ChipProbing Station ...
[Die Bonder]: Epoxy Bonder, Soft Solder Bonder, Eutectic Bonder, CameraModule Attach Equipment, IGBT Multiple Chip Bonder, Tesla-package SolderPreform&Clip Bonder (T-PAK, ST-PAK process) ...
[Test Handler]: Turret, Tray, Tape&Reel, Pick&Place, Gravity Test Handler ...
[AOI]: Wafer Inspection AOI, Wire Bond AOI, Post-Bond AOI ...
[Cleaner]: Water Cleaner, Plasma Cleaner ...
[Pick and Place handler]: Customized design ...
[Curing Oven]: ...

Не удается загрузить Youtube-плеер. Проверьте блокировку Youtube в вашей сети.
Повторяем попытку...

S-King Product: Flip Chip Die Bonder (High Precision Solution)

Доступные форматы для скачивания:

Скачать видео

Информация по загрузке:

Скачать аудио

Похожие видео

Besi 8800 automated by i-Operator # CASTEC

Besi 8800 automated by i-Operator # CASTEC

How to make a PCB – PCB production process in 33 steps

How to make a PCB – PCB production process in 33 steps

Máy nghiền ngô,máy nghiền bột khô,máy nghiền cám viên,máy xay bắp,máy xay ngũ cốc,máy xay ngô

Máy nghiền ngô,máy nghiền bột khô,máy nghiền cám viên,máy xay bắp,máy xay ngũ cốc,máy xay ngô

Why Hybrid Bonding is the Future of Packaging

Why Hybrid Bonding is the Future of Packaging

Unbelievable Smart Worker & Hilarious Fails | Construction Compilation #2 #fail #construction

Unbelievable Smart Worker & Hilarious Fails | Construction Compilation #2 #fail #construction

ASM AD 838 L G-2 Die Bonder (A# 72081)

ASM AD 838 L G-2 Die Bonder (A# 72081)

iNEMI Packaging Tech Topic Series: Equipment Capabilities & Challenges to Support Advanced Packaging

iNEMI Packaging Tech Topic Series: Equipment Capabilities & Challenges to Support Advanced Packaging

Удивительный процесс изготовления пуль для боеприпасов на местном заводе.

Удивительный процесс изготовления пуль для боеприпасов на местном заводе.

Разливка металла в магнитном поле

Разливка металла в магнитном поле

High-End Manufacturing: LED Chips Mass Production in China

High-End Manufacturing: LED Chips Mass Production in China

Корпусирование полупроводников - технологический процесс сборки

Корпусирование полупроводников - технологический процесс сборки

Discover: die-to-wafer hybrid bonding | CEA-Leti

Discover: die-to-wafer hybrid bonding | CEA-Leti

How It's Made: Multilayer PCB Manufacturing Insight

How It's Made: Multilayer PCB Manufacturing Insight

Advances in Interconnect & Assembly Technologies for Next Generation Electronic Systems

Advances in Interconnect & Assembly Technologies for Next Generation Electronic Systems

КАК Япония Незаметно СТАЛА Мировой Станкостроительной ДЕРЖАВОЙ!

КАК Япония Незаметно СТАЛА Мировой Станкостроительной ДЕРЖАВОЙ!

Wirebonding Overview Animation

Wirebonding Overview Animation

LBSemicon 공정소개영상(한국어)_엘비세미콘

LBSemicon 공정소개영상(한국어)_엘비세미콘

[JEL] Wafer 반도체 이동로봇/Align

[JEL] Wafer 반도체 이동로봇/Align

Multi functional Die bounder basic inter introduce

Multi functional Die bounder basic inter introduce

台積公司-晶圓廠導覽