Tresky Showroom 2022 - Versatile Die Bonders
Автор: accelonixbnx BV
Загружено: 2022-03-15
Просмотров: 211
Описание:
Accelonix Benelux distributor of Tresky Die Bonding Micro Assembly solutions.
Applications : Die bond, Flip-chip, Eutectic Soldering, RFID, ... and many more.
NEW PRODUCT SERIES LAUNCHED
The T-5000series Die Bonder is what we would like to call an evolution. The result of 40 years experience in developing high quality Die Bonder is based on a new frame concept and fulfils highest requirements for up- to-date applications in R&D and small scall productions of the worldwide microelectronic industry.
With increased travel range and our TRUE VERTICAL TECHNOLOGY, higher rigidity, increased image quality and new T-Suite software features, the T-5000serie achieves repeatable accuracy not compromising the proved flexibility and ergonomics.
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