[Eng Sub] TSMC SOIC

IC Packaging

Semiconductor Packaging

Semiconductor

yt:cc=on

TSMC

TSMC SoIC

SoIC

EVG

SUSS MicroTec

ASM Pacific

Besi

Applied Materials

Автор: Semicon Talk

Загружено: 2021-07-17

Просмотров: 19592

Описание: 1. TSMC SoIC?
2. Process
: Step 1. CMP (Chemical Mechanical Polishing)
: Step 2. Surface Activation by plasma
: Step 3. Chip to Chip Bonding for dielectric material bonding at room temperature
: Step 4. Anealing for Cu to Cu metal bonding at high temperature
: Key machine suppliers - EVG, SUSS MicroTec, ASM Pacific, Besi, and Applied Materials
3. Applications
: Sony Image Sensor
: AMD 3D V-Cache

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[Eng Sub] TSMC SOIC

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