Semicon Talk

[Eng Sub] NVIDIA GTC 2024

[Eng Sub]TSMC 4Q2023 Earnings

[Eng Sub] Package Reliability Failure

[Eng Sub] Package Reliability Test

[Eng Sub] CVD (Chemical Vapor Deposition)

[Eng Sub] ASML 3Q21 Financial Result

[Eng Sub] Worldwide Wafer Fab. Capacity

[Eng Sub] TSMC 3Q 2021 Earning

[Eng Sub] Cu Wire Bonding

[Eng Sub] AiP (Antenna in Package)

[Eng Sub] News Review-Foundry Market Tracking Toward Record-tying 23% Growth in 2021

[Eng] Company Analysis

[Eng Sub] Sputtering

[Eng Sub] Intel Foveros

[Eng Sub] Intel EMIB

[Eng Sub] How to gather information

[Eng Sub] Wafer Level Chip Scale Package (WLCSP)

[Eng Sub] TSMC SOIC

[Eng Sub] Фотолитография

[Eng Sub] TIM (Материал теплового интерфейса)

[Eng Sub] EUV Lithography

[Eng Sub] Passive Components

[Eng Sub] Chiplet

[Eng Sub] Плазменная нарезка

[Eng Sub] Stealth Dicing

[Eng Sub] Laser Dicing - Ablation

[Eng Sub] MEMS Microphone - Smartphone, Wireless Earbuds, A.I. Speaker

[Eng Sub] NAND Memory - 2D NAND, 3D NAND, Samsung, Kioxia, Western Digital, SK Hynix, Micron, Intel

[Eng Sub] Solder ball - Lead, Lead free: Senju, Alpha, Ducksan, MKE

[Eng Sub] Fingerprint Sensor (FPS): Capacitive, Optical, Ultrasonic, Apple iPhone, Samsung Galaxy