HC2024-T2.1: The Cooling of Hot Chips: How thermal technology is keeping up with the AI revolution
Автор: hotchipsvideos
Загружено: 2024-12-02
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Tutorial 2, part 1, Hot Chips 2024, Sunday, August 25, 2024.
Organizer: Seshu Madhavapeddy, Frore Systems
The AI revolution requires massive amounts of processing power, and with all of this processing power also comes something undesirable: lots of heat. The increasingly high energy density of the latest processors requires increasingly complex solutions to get rid of their waste heat effectively. The first half of this tutorial explores how cooling of these chips occurs in large, AI-oriented data centers.
Thermal techniques for higher data center compute density
Tom Garvens, Supermicro
Next-generation cooling for NVIDIA’s Accelerated Computing
Ali Heydari, NVIDIA
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