Wirebond & Die AOI solutions
Автор: Cortex Robotic
Загружено: 2022-03-09
Просмотров: 857
Описание:
Die Attach & Wire Bonding defects detector. We offer you a great AOI solution for these 2 processes.
Check out our infographic video now!
With a flexible and wide range of inspection capabilities, even defects on fine die & wire such as:
-Epoxy Overlow & Underfill, die tilt, die crack, chipped, cosmetics defects, die position
-Wire drop, wire sagging, smear bond, narrow bond, missing wire, double wire, wire damage, wire broken wire tail
-die overcoat (over & underfill)
AIt is a proven successful solution serving the market leader in the industry. So what are you waiting for?
FOR MORE INFO: https://bit.ly/365C4aa
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