Lenovo Legion Slim 5 DIY Repaste: UPSIREN U6 PRO + PTM7950 by CSGR | -15°C CPU Drop
Автор: ComputerSystemsGR
Загружено: 2026-02-11
Просмотров: 293
Описание:
DIY thermal service on a Lenovo Legion Slim 5 using UPSIREN U6 PRO and PTM7950 by CSGR.
Baseline vs after results were measured with HWiNFO + Unigine Superposition (1080p Extreme), with the ambient temperature visible on the desk thermometer (~20–22°C during filming/testing).
Materials used
UPSIREN U6 PRO — thermal putty (VRAM / VRM / gap filling contact points)
PTM7950 by CSGR — phase change material (CPU & GPU dies)
Results (next-day check)
CPU max: 81.2°C → 66°C (−15.2°C)
GPU max: 72.5°C → 64.3°C (−8.2°C)
GPU Hotspot max: 80.9°C → 71.5°C (−9.4°C)
GPU Memory Junction max: 76°C → 70°C (−6°C)
Superposition score: 6499 → 6496 (essentially unchanged)
Why the benchmark score stayed almost the same
PTM7950 by CSGR is a phase change material and typically benefits from multiple heat cycles over several days before it reaches its final behavior. This video shows a next-day check, not a multi-day conditioning test.
This Lenovo Legion Slim 5 was already running well with reasonable baseline performance, so there was limited extra headroom to unlock in raw benchmark score. The main win here is lower operating temperature, and therefore lower fan noise potential, without sacrificing performance.
Important honesty note (PTM offcut)
During assembly, an offcut of PTM7950 by CSGR was temporarily left inside the chassis.
Part of our workflow is collecting and reconciling leftover consumables at every step (wipes, offcuts, pads or putty portions, etc.). Before powering on, we noticed the missing PTM7950 by CSGR offcut, located it, and removed it before starting the test.
This is a reminder that the process may look simple on camera, but there are many small failure points, even for experienced technicians, so checklists matter.
Data and logs
HWiNFO BEFORE / AFTER log: https://cs-labs.co.uk/PUBLIC/benchmar...
Thank you to the laptop’s owner for trusting us with his machine. Because it had to be returned promptly, we did not keep it for multiple days of continuous benchmarking. This is a professional service turnaround, not a long-term lab soak test.
Disclaimer: This video is for informational and entertainment purposes only. Laptop disassembly and thermal work carry real risks, including ESD damage, stripped screws, torn connectors, short circuits, overheating from incorrect application, warranty voiding, and personal injury from tools or chemicals. Attempt this only if you have the proper tools, experience, and safety practices. You are responsible for any outcome if you choose to replicate anything shown here. When in doubt, use a qualified technician.
The experiment presented in this video was conducted as part of the project "Data Recovery and Remote Computer Diagnostic Services with AI" (Application Code: ΕΚΠΑΡ01-0063510), funded under the strategic action "Research - Innovate" of the "Competitiveness" Programme.
The project is co-financed by Greece and the European Union through the European Regional Development Fund (ERDF).
Beneficiary: Karydopoulos Panagiotis Andreas (Computer Systems) Framework: ESPA 2021-2027
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