Eless plating wet bench Vulcanio for efficient UBM (under bump metallization)

Описание: New design, new features, new performance - in 2020 the tool design of our eless wet bench Vulcanio was profoundly changed and new technical features were added.

For semiconductor manufacturing, the implementation of advanced, reliable UBM process technologies, highest throughput achievement and best TCoO performance of the production equipment are key success factors.

The AP&S Vulcanio covers all these factors perfectly. Indeed, the batch tool was specially developed for under-bump metallization with electroless deposition technology on Al- and Cu-based substrates for metallization with nickel, palladium and gold. It has already been successfully used for mass production by leading semiconductor manufacturers since 2009. Since then, the system has been continuously developed and optimized in close cooperation with AP&S customers, leading semiconductor producers worldwide.

#semiconductor #production #underbumpmetallization #AP&S #donaueschingen #maschinenbau