Vertiv™ SmartIT OCP: Built for AI scale
Автор: Vertiv
Загружено: 2026-02-27
Просмотров: 76
Описание:
Vertiv™ SmartIT OCP is engineered for the next wave of high‑density AI and compute deployments. This overview highlights how the platform brings together power, cooling, and integration features that align with OCP ORV3 architecture while supporting rapid, large‑scale rollout.
Explore how Vertiv™ SmartIT OCP combines factor‑integrated design, in‑rack 33kW power shelves with a 1400A DC busbar, optional scalable liquid cooling through Vertiv™ CoolChip CDU, and blind‑mate manifolds for clean, consistent deployment. With integrated cable routing and seamless compatibility with Vertiv™ SmartRun, the system is built to accelerate server integration and streamline operations for modern AI environments.
AI‑ready. Factor‑integrated. Solution‑aligned.
Learn more at https://www.vertiv.com/en-us/
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#BuildforAIscale
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