Porous Ceramic Vacuum Chuck | Uniform Holding for Thin Wafers & Film Substrates

Описание: #Porous Ceramic Vacuum Chuck#VacuumChuck #ThinWafer #LaserProcessing
Full specs & inquiry 👉 https://longyi-advanced-ceramic.com/p...

This short video shows how a porous ceramic vacuum chuck supports thin wafers and hard substrates during laser cutting and precision processing. By using a fine, uniform pore structure, the chuck applies even vacuum across the surface, helping reduce wafer deformation and slippage compared with groove or O-ring chucks. It is suitable for SiC, ceramic and other fragile substrates in high-precision tools.

Key features
• Porous ceramic vacuum chuck for thin wafers and rigid substrates
• Uniform pore structure for even vacuum holding over the entire support area
• Reduced local bending and deformation compared with groove-type or O-ring chucks
• Suitable for Si, SiC, ceramic and glass wafers used in laser cutting and inspection
• Customizable size, pore size, vacuum zone layout and mounting interface to match existing stages
• Flatness and surface finish defined according to process needs for focus and cut quality

Typical applications
• UV laser cutting of SiC and ceramic wafers on porous chucks
• Thin wafer handling in dicing, grinding and inspection equipment
• Vacuum holding of ceramic substrates, glass panels and specialty materials
• Fixtures and stages for precision positioning in semiconductor and electronics tools

FAQ – typical questions from engineers
• Q: When should I use a porous ceramic vacuum chuck instead of a groove or O-ring chuck?
A: Porous chucks are used when thin or warped wafers need more uniform support and vacuum, or when local bending from grooves and O-rings affects focus and process quality.
• Q: What pore size should I choose for my porous ceramic vacuum chuck?
A: Pore size depends on vacuum level, wafer type and required cleanliness; smaller pores help support thin wafers with less imprint while still allowing stable vacuum flow.
• Q: How flat does the porous ceramic vacuum chuck need to be for laser cutting?
A: Flatness requirements are based on your laser focus depth and wafer thickness; we can define flatness with you according to your process window and equipment specification.
• Q: Can the vacuum area and mounting interface be customized for my tool?
A: Yes, vacuum zones, manifold connections and bottom mounting interfaces can be customized to fit your existing stage or tool design.

Other names
Other names: porous vacuum chuck, porous ceramic chuck, vacuum porous ceramic stage

Contact
Contact: [email protected] / [email protected]