One of the LED packaging process - bonding wire

Описание: The wire bonding machine generally refers to the ultrasonic wire bonding machine, which can be divided into gold wire machine, aluminum wire machine, and copper wire machine according to the wire material. The welding method, can be divided into spherical welding machines and wedge welding machines. Mainly used in inner lead welding of high-power devices, MOSFET, IGBT, light-emitting diode (LED), laser tube (laser), small and medium power transistors, integrated circuits, and some special semiconductor devices.

advantage
1. High reliability: The fully automatic wire welding machine is captured by adjustable digital time, pressure, power, temperature, arc, and high-precision CCD video. Ideal welding results.
2. Cost saving: It can effectively save labor costs. One person can operate multiple machines, and it can also avoid many defective products when using manual wire welding machines, resulting in material waste.
3. Low energy consumption: The energy required by the automatic wire bonding machine is equivalent to that of an ordinary manual wire bonding machine.
4. Machine life: The automatic wire welding machine adopts high-quality imported accessories and finishing parts, which have excellent anti-wear performance, easy installation, high welding precision, and effectively delays the machine's life.
5. High efficiency: The typical welding speed is several times higher than that of the traditional manual wire bonding machine.
6. Automation: Small size, less maintenance workload, and strong adaptability make the automatic wire bonding machine the first choice for LED automatic packaging production lines.
7. Good conductivity after welding, and the resistivity is extremely low or almost zero.
8. Low requirements for welding metal surface, can be welded by oxidation or electroplating.
9. The welding time is short, without any flux, gas, or solder.
10. Welding without sparks, environmental protection, and safety.
principle
1. The machine is used to realize the surface welding of different media, which is a physical change process. First, the head end of the gold wire must be processed to form a spherical shape (this machine uses negative electron high voltage to form a ball), and the welded metal surface is pre-processed. Heat treatment; then, under the combined action of time and pressure, the gold wire ball produces plastic deformation on the metal welding surface so that the two media can reach reliable contact, and through ultrasonic friction and vibration, the two metal atoms have the effect of atomic affinity. The metal bond is formed under the metal bond, which realizes the welding of the gold wire lead. The gold wire ball welding is superior to the welding of the silicon aluminum wire in electrical performance and environmental application, but the application range is relatively narrow because the welding parts made of precious metals must be heated.
Evolution
Manual wire bonding machine - semi-automatic wire bonding machine (modified machine) - low-speed automatic wire bonding machine - high-speed automatic wire bonding machine
Development
Fully automatic wire bonding machines have been widely used in the LED industry and are indispensable equipment for packaging in the LED industry. Manual and semi-automatic wire bonding machines have been gradually replaced by automatic wire bonding machines due to their inability to meet market demand in terms of production capacity. However, it is still indispensable as an auxiliary equipment for making up the line for a long time. The automatic wire bonding machine is technically considered a high-tech product. Due to the relatively high technical content of the automatic wire bonding machine, most of the domestic market is still occupied by imported equipment, and the price of the imported automatic wire bonding machine has always been high. To a large extent, it limits the development of China's LED market. There is still a certain gap between domestic automatic wire bonding machines and imported machines in terms of wire bonding speed. If other packaging equipment such as die bonders, glue dispensers, and glue filling machines can reach a high level of localization, it is necessary to go through years, or even longer efforts