CoPoS: Nvidia's Packaging Advantage and the Rectangular Revolution

Описание: The source provides an extensive analysis of a fundamental shift occurring in the semiconductor industry's manufacturing technology, moving beyond the limits of traditional circular silicon wafers. This revolution is centered on TSMC's new panel-level packaging solution, CoPoS (Chip-on-Panel-on-Substrate), which utilizes large, rectangular substrates to vastly improve material utilization and increase the maximum size of AI accelerators. The report argues that Nvidia is securing a significant competitive moat by gaining exclusive early access to CoPoS, alongside TSMC’s advanced A16 process node for its 2028 "Feynman" architecture. This technological combination will grant Nvidia superior yield, lower costs, and increased integration capabilities compared to competitors like AMD and Google, who are constrained by the legacy CoWoS (Chip-on-Wafer-on-Substrate) technology or forced to rely on less mature alternative packaging solutions. Ultimately, the transition from round wafers to rectangular panels is depicted as an economic necessity driven by the enormous requirements of scaling AI computation, creating a structural advantage for the early adopters.

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