Discovery Of A Direct Way To Bond & Debond Semiconductor. No Glue Required. Here's How
Автор: Facts Wid Aman
Загружено: 2025-11-23
Просмотров: 17383
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Researchers have developed a direct way to bond and debond two-dimensional (2D) semiconductors without using any glue-like materials, paving the way for smaller and more efficient electronic devices. As engineers push to shrink components while improving performance, 2D semiconductors—single-layer materials with tunable electrical properties—have emerged as promising building blocks. Yet creating large, high-quality wafers and stacking them cleanly has remained a major challenge.
A team from the Songshan Lake Material Laboratory, the Chinese Academy of Sciences, and collaborating institutions introduced a method that enables two 2D semiconductor wafers to bond directly when brought into contact. Their process produces extremely flat, clean, and chemically active surfaces that naturally adhere without contamination. It works in both vacuum and glovebox environments and requires no intermediate layers, ensuring pristine interfaces and uniformity across entire wafers. The technique also allows precise control over layer number and twist angle.
Using this approach, the researchers produced various homostructures and heterostructures, including combinations of MoS₂ and MoSe₂, and demonstrated bonding onto high-κ dielectric substrates while preserving electronic properties. This reversible bonding strategy could greatly advance the fabrication of high-performance transistors and other next-generation devices based on 2D Materials.
Read full article here: https://www.uncoverreality.in/2025/11...
Reference: Liu, J., Zhao, J., Li, T. et al. Direct bonding and debonding of two-dimensional semiconductors. Nat Electron (2025). https://doi.org/10.1038/s41928-025-01...
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