i3 Micro Module at CES 2023

Описание: Watch this interview at CES to learn more about the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity capability. Through TDK’s collaboration with Texas Instruments, the i3 Micro Module integrates the TI SimpleLink™ platform, featuring the CC2652R7, an Arm® Cortex®-M4F multiprotocol 2.4-GHz wireless 32-bit microcontroller (MCU) for real-time monitoring.
The i3 Micro Module integrates TI's CC2652R7
https://www.ti.com/product/CC2652R7?k...