Huawei’s 2nm SHOCK Announcement STUNS the Global Tech Industry!

Описание: A patent filing published on December 6, 2025 revealed detailed technical methods attributed to Huawei for manufacturing two nanometer semiconductor chips without using extreme ultraviolet lithography equipment. The disclosure drew attention because Huawei has faced U.S. and allied export restrictions since 2019 that limit access to advanced chipmaking tools, including EUV systems produced exclusively by ASML. The patent outlines a manufacturing approach based on deep ultraviolet lithography and self-aligned quadruple patterning, a process that challenges long-held industry assumptions about the physical limits of non-EUV chip production.

The patent describes a multi-step metal integration process designed to achieve sub-21 nanometer spacing using older lithography tools, though analysts note that yield rates and production costs would likely be significantly higher than current EUV-based processes used by TSMC and others. While no evidence exists of two nanometer chips being produced at scale, the filing signals continued Chinese investment in semiconductor self-sufficiency amid geopolitical restrictions. Industry observers emphasize that translating patents into mass production could take several years and would require a large supporting ecosystem of materials, equipment, and engineering expertise.
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