Discover die to wafer hybrid bonding CEA Leti
Автор: 이상한 나라의 아이티
Загружено: 2024-05-23
Просмотров: 364
Описание:
Discover CEA-Leti expertise in terms of hybrid bonding: the different stages of die-to-wafer process in CEA-Leti clean room, starting with Chemical Mechanical Planarization (CMP), through die-to-wafer bonding, alignment measurement, characterization of bonding quality and grinding.
#HybridBonding #3D #packaging
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