Making Chips Like Lego Bricks!

Описание: The next battleground in chip design and manufacturing is the interconnect - and packaging plays a vital role in that, especially as chips get bigger, more complex, disaggregated, and modular. TSMC's OIP Forum is a series of six events that occur globally, bringing the key players in the industry as well as customers and partners to discuss the future of chip design and how to work together on unified procedures, ensuring future chips are optimized and cost effective.

If you're interested in learning more:
OIP: https://www.tsmc.com/english/dedicate...
3Dblox: http://www.3dblox.org


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