SABIC EXTEM™ resin for co-packaged optical connections
Автор: SABIC
Загружено: 2023-01-27
Просмотров: 959
Описание:
Producing miniaturized lens arrays with complex shapes for co-packaged optics calls for new materials that can overcome design, manufacturing scalability and system cost drawbacks of glass or direct silicon integration.
SABIC’s new EXTEM™ RH resin addresses these needs as it allows optical engineers the design freedom of injection molding whilst it can withstand the 260°C peak temperature of printed circuit board (PCB) reflow soldering.
This innovative product can help customers move the optics much closer to the main switching application specific integrated circuit (ASIC) to improve bandwidth and energy requirements.
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