AEMtec Imagefilm - "From Wafer to Packaging"

Описание: AEMtec GmbH – E2MS – From Wafer to Packaging High-end chip level technology services for advanced electronic microsystems.

http://www.AEMtec.com

Comprehensive Process Capabilities:
Cleaning
Electronic design
Schematic capture
Multiple alloys
Multiple layer rigid
Layouting on flex
Blue foil application
Blind and buried vias
Design for test and verification
Component library and 3D models
Automated Wafer inspection
Wafer map translation and creation
Fully automated dicing up to 12” wafers
Printing on 12” MEMS wafers
Screen printing of flux on wafers
Automated 3D paste inspection
Balling @ 60µm Loop control
New wafer map UV glue dispensing
Optical glue dispensing
Surface-mount device
Flying probe testing
Flying probe point definition
Flying probe enhanced programming
Placement of micro-optical components
Wafer inspection and fully automated repair
Stud bumping high speed with 22µm
Au wire Wedge-wedge gold bonding and shape control
Reflow under vacuum and low temperature alloys
High accuracy placement of multi mirror MEMS arrays

There are many more...

Director: Robert Patz
Camera & Edit: Johannes Plank
Sounddesign: Jörg Brinkmann
Music: Broke For Free