S36.2 Yield & Defectivity in Semiconductor Industry (part 2)

Описание: v3-S36.2 Part 2: Course Description:
This course explores the critical concepts of yield and defectivity in semiconductor manufacturing and their profound impact on production efficiency, quality, and profitability. Participants will learn how yield is calculated at various stages—from wafer fabrication to final test—and how defectivity, measured by defect density, directly influences chip performance and cost. The course examines common defect sources, such as particles and process deviations, and introduces advanced monitoring techniques like optical and e-beam inspection, electrical testing, and real-time in-line monitoring.

Learners will gain insights into yield improvement strategies involving statistical control, root cause analysis, AI-based analytics, and process optimization. The importance of predictive analytics, real-time feedback systems, and automated corrective actions is emphasized as key enablers of faster response and higher throughput. Economic implications are detailed, highlighting how even small yield improvements can result in substantial cost savings and competitive advantages. Looking ahead, the course addresses industry trends including AI integration, digital twins, and quantum computing, outlining their role in shaping the future of defect control and yield management.