Large-capacity EM solver to enable multi-die 2.5D/3D IC SI/PI analysis

Описание: Metis is Xpeedic’s simulation platform for advanced 2.5D/3DIC Chiplet packaging design.
It can be applied to the electromagnetic analysis of die, flip-chip BGA (FCBGA), wafer-level package, multi-Chiplet 2.5D/3D advanced package, and chip-package co-simulation.
The Metis 3D full-wave high-precision electromagnetic simulation engine can meet the efficiency and accuracy requirements of signal and power models in heterogeneous integration, and support multi-scale simulation from nanometer to centimeter level.