3D WoW IC Design Accelerates AI Applications Episode 1: Security and Surveillance
Автор: 智成電子syntronix
Загружено: 2025-11-24
Просмотров: 5
Описание:
Advanced DRAM wafer stacking (3D Wafer-on-Wafer IC) design technology helps clients to develop 3D IC that enhance memory capacity and bandwidth, thereby accelerating edge AI applications.
AI chips developed by 3D WoW IC design technology can be applied to the field of image recognition for security purposes. This advancement enhances the ability to monitor environments and issue instant warnings, thereby making cities, streets, commercial buildings, communities, and homes safer.
Syntronix is a professional IC design house. We invite you to contact us for collaboration and to create an innovative future.
★ Official website: www.syntronix.com.tw
★ Email: [email protected]
★ Tel: +886-3-6200200 ext. 1082
#Syntronix #Edge AI #DRAM #3D WoW IC
Music source: Motion Array
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