Solder Wetting of Surface Mount IC during Reflow Soldering

Описание: Solder wetting in surface mount soldering refers to the desirable process by which molten solder adheres and spreads evenly over the surfaces of the solderable components (such as component leads or terminations) and the corresponding pads on the printed circuit board (PCB) during the soldering process. Proper solder wetting is crucial for creating reliable, strong, and durable solder joints in surface mount technology (SMT) assembly.

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