Laser-Direct-Structuring (LDS) of 3D-MIDs
Автор: LPKF Laser & Electronics SE
Загружено: 2010-06-14
Просмотров: 22449
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With Laser-Direct-Structuring (LDS) it is possible to produce circuit layouts on complex 3D carrier structures (3D-MIDs). Learn more: https://www.lpkf.com/en/industries-te...
The laser beam structures the layout directly into the molded plastic part (3D-MID - Molded Interconnect Device). As a result, weight and fitting space can be effectively reduced. The designer enjoys complete 3D capability on freeform surfaces and great freedom for redesigns.
Laser-Direct-Structuring (LDS) takes place immediately after single component injection moulding of the carrier: a laser beam takes only a few seconds to transfer the artwork directly from the computer onto the plastic component without tools or masks. Subsequent metallization and SMD assembly operations result in highly sophisticated products.
Download our 3D-MID design rules for developers:https://en.lpkf.com/knowledge-center/...
Laser-Direct-Structuring (LDS) of 3D-MIDs
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