How to Decap ICs with Rosin
Автор: jkenny1
Загружено: 2019-11-15
Просмотров: 3961
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This video shows my attempt to decap 3 ICs (2 identical Bluetooth SoC BGAs and 1 STM32F103) using boiling rosin aka colophony. There is scattered information in article form about this process, but some contradictory information about how long to boil the ICs, and how to process them afterwards. My attempt was only mostly successful on 1 of the 3 ICs I tried, but I learned a bit during the process and would likely have better luck if I tried again. It also appears that the epoxy formulations of various ICs vary quite a bit, and it will take your own experimentation to find the right heat/time combination to work.
Coming soon, I will show a video on how to decap simple (non-stacked) ICs using sandpaper, which is way faster (~10 minutes vs ~2+ hours) and safer (no rosin fumes to deal with) though has a higher chance of IC damage.
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