Fraunhofer EMFT: 25 Years of 3D Integration in Munich

Описание: While the rest of the world anticipates the coming of 3D ICs using TSVs in high volume manufacturing, Fraunhofer EMFT and its industrial partners, Infineon and Siemens, are more concerned in applying the processes today, in real products that help improve quality of life. My visit last month to Fraunhofer EMFT in Munich gave me a first-hand look at what's going on at this research institute that, according to program director Peter Ramm, has been working on 3D integration for the better part of 25 years.