BGA Glue & Solder Cleanup - iRefab
Автор: iRefab
Загружено: 2026-03-07
Просмотров: 72
Описание:
How we cleanup the underside of a Ball Grid Array Integrated Circuit (BGA IC). The process involves bringing the melting point of the solder down to 180 degrees celsius and removing any glue residue with a chisel blade tool.
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Something not working? Can't repair it yourself? Don't throw it away just yet! Contact us and we can do it for you (mail in repairs). Contact us through the website below:
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https://www.irefab.co.uk
Want to learn electronics repair? Watch our free video series here!
https://irefab.co.uk/videos/
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