Ventiva Brings Innovative Solid-State Cooling to the AI Data Center
Автор: TechArena
Загружено: 2025-10-16
Просмотров: 96
Описание:
Ventiva’s CEO, Carl Schlachte, returns to In the Arena during the OCP Summit (San Jose) with a simple message: the thermal breakthroughs forged in ultra-tight laptop envelopes now translate directly to rack-scale AI infrastructure. We dig into what that means for server design, validation, and rapid deployment.
Chapters
00:00 Intro
00:37 From laptops to data centers—why it transfers
08:20 Ecosystem reaction on the OCP floor
09:29 Validation, lifetime, and scaling lessons from laptops
09:43 What “no new engineering” means for servers
10:09 Where to learn more
If you’re wrestling with hot, dense AI racks, this one’s for you.
Subscribe to TechArena's YouTube channel for more OCP 2025 coverage and AI infra insights.
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