Tombstone of chip capacitor during reflow soldering - Surface Mount Process

Описание: The cause of this defect is generally a difference in the copper either side of the footprint leading to a thermal imbalance during reflow - The solution is to ideally change PCB design to balance copper but if this not possible then reflow profile should be modified to allow both sides of component to heat up equally. Poor component solderability or placement can also cause this defect.

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