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5G End of Project reliability and loss properties of copper foils for 5g appl os2GEenc
Автор: iNEMI TV
Загружено: 2026-01-19
Просмотров: 25
Описание: High-frequency electronics need better signal integrity, but traditional copper foil treatments create rough surfaces that increase signal loss. As industry shifts to extremely low-profile foils, new ways are needed to evaluate how foil surface properties affect both adhesion and high-frequency performance. Please join this end of project webinar where we will discuss how the INEMI project tackled these issues by correlating signal loss with the roughness and conductivity of ultra-smooth copper foils using alternative oxide treatments.
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