Dam & Fill Encapsulation
Автор: Advanced Packaging
Загружено: 2018-10-01
Просмотров: 9751
Описание:
Encapsulation is the process of encasing a die which has been die and wire bonded in a protective coating. The purpose of encapsulation is to protect the semiconductor die and its wire bonds from its operating environment. The potential sources of damage to dies include moisture, dust, dirt, solvents, mechanical straining and scratching. An encapsulation deposition can consist of epoxy, sealants and additives individually or in combination with each other.
Find out more at https://advpackaging.co.uk/encapsulation
Contact us at https://advpackaging.co.uk/contact to discuss your applications or requirements. We have a dedicated packaging facility with a range of equipment to provide you comprehensive packaging services.
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![Fill - Two Part Encapsulation [Part 2]](https://image.4k-video.ru/id-video/DYbeIkHkq58)
