ficonTEC - Electro-optical Wafer-level Test Systems for PICs
Автор: ficonTEC Service GmbH
Загружено: 2021-10-14
Просмотров: 1571
Описание:
This video illustrates the current mixed-signal test capabilities of the wafer-level PIC test systems recently and currently (Q3) being delivered to customers around the globe.
After wafer placement, the electro-optical test routine runs fully automatically, including device I/O port location/referencing and predefined test procedures based on the wafer design protocol, alignment of the electrical and/or optical probes according to the actual test requirements, as well performance characterization and generation of device protocol inline with standard or customer specific qualification requirements.
Be sure to check our 'ficonTEC Insider' blog page, News and LinkedIN for regular updates to the Wafer-level Test product series.
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