High-Speed Die Sorting: AOI Inspection & Tape Packaging
Автор: EPS Programming
Загружено: 2025-08-22
Просмотров: 895
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A quick look at the automated "pick, inspect, and place" process at our R&D facility in Brno.
In this short clip, you'll see a turret system equipped with 16 pick-up heads rapidly sorting wafer dies. Each die undergoes an Automated Optical Inspection (AOI) to check for defects before being precisely placed into a carrier tape. The final step involves sealing the tape, securing the components for the next stage of assembly.
This is a critical step that guarantees the quality and reliability of electronic components.
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#semiconductor #AOI #pickandplace #Wafer #manufacturing #electronics #automation #engineering
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