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Faster, More Predictable Path to Multi-Chiplet Design Closure -- Cadence Design Systems
Автор: EE Journal
Загружено: 2022-03-03
Просмотров: 44348
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March 3, 2022 -- The challenges for 3D IC design are greater than standard chip design - but they are not insurmountable. In this episode of Chalk Talk, Amelia Dalton chats with Vinay Patwardhan from Cadence Design Systems about the variety of challenges faced by 3D IC designers today and how Cadence’s integrated, high-capacity Integrity 3D IC Platform, with its 3D design planning and implementation cockpit, flow manager and co-design capabilities can help you with your next 3D IC design.
More information about Integrity 3D-IC Platform from Cadence Design Systems: https://bit.ly/3Hz9j2M
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