Enabling New Ways to Wire and Integrate Chips
Автор: Applied Materials
Загружено: 2022-05-26
Просмотров: 5437
Описание:
Ever wonder what it takes to build the advanced chips that enable the amazing digital products we use every day?
Through innovations in materials engineering, Applied is improving transistor wiring so chips can operate with better performance and power efficiency. We are helping customers re-route the chip’s power delivery network so that scaling can continue beyond the 3nm node with improvements in power and area. And, through advancements in heterogeneous integration, including hybrid bonding, we are enabling chip and system companies to optimize their designs for power, performance, area, cost and time-to-market.
This is what we do at Applied Materials as the PPACt enablement company™
© 2022, Applied Materials, Inc. All rights reserved. Any unauthorized use, including reproductions, modification, distribution or publication, without the prior written consent of Applied Materials, Inc., is strictly prohibited.
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