Solder ball placement solutions | Enables solder ball placement with SMT equipment

Описание: In recent years, the electronics manufacturing industry (EMS and electronics manufacturers) has begun to produce Ball Grid Arrays (BGAs) in-house, rather than relying on procurement from external manufacturers.
However, dedicated solder ball placement machines are expensive and the high cost of introducing equipment, such as the need for SPI machines (solder ball inspection machine) to check for missing placements remains a major issue.

Fuji offers solder ball placement solutions that do not require dedicated machines to resolve these issues.
Without introducing dedicated machines, simply loading dedicated units on NXTR S model placement machines enables one-stop processing from batch solder ball placement to inspection and replenishment.


-----------------------------------------------------------------------
Products related to this video
-----------------------------------------------------------------------

Solder ball placement solutions | Enables solder ball placement with SMT equipment
https://smt.fuji.co.jp/en/topics/11736

-----------------------------------------------------------------------
Website
-----------------------------------------------------------------------

Fuji official website
https://www.fuji.co.jp/en/

FUJI SMT Site Note: This is a website that focuses on our SMT-related information.
https://smt.fuji.co.jp/en/

-----------------------------------------------------------------------
SNS
-----------------------------------------------------------------------

LinkedIn
  / fujicorporation  


✅Contact
https://smt.fuji.co.jp/en/contact/

✅To apply for tours and demonstrations
https://smt.fuji.co.jp/en/demoform/

✅To sign up for our free newsletters
https://smt.fuji.co.jp/en/newsletter/

✅To subscribe to our channel
   / @fuji_smt