Breaking the barrier, chip level cooling up to and beyond 1000W in single phase dielectric fluid
Автор: Open Compute Project
Загружено: 2024-05-01
Просмотров: 509
Описание:
Kelley Mullick, Vice President - Iceotope Technologies
In 2023, the prominence of liquid cooling has surged within the data center industry, notably driven by the advancements in generative AI technology. One of the challenges faced by liquid cooling solution providers is demonstrating the technology’s capacity to facilitate chip-level cooling up to and beyond 1000W. The dense IT equipment needed to support AI - predominantly CPUs and GPUs – will require this type of cooling capability within the next three years. There has been a perception in the industry that single-phase liquid cooling is limited to approximately 400W at the chip level. Iceotope would like to share our recent testing results to demonstrate to the community how we have achieved 1000 W cooling at the chip level and beyond with single phase dielectric achieving thermal resistances that are competitive with other industry leading liquid cooling technologies.
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