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Dispensing solder paste, pick and place LED modules and micro laser soldering on a 3-D MID
Автор: Häcker Automation GmbH
Загружено: 2011-08-25
Просмотров: 28735
Описание: This video shows a test we've been carrying out for a prospective customer. The aim was to dispsense solder paste at various pads on a 3-D MID, pick up LED modules from a Waffle Pack, place them on the MID surface and finally solder the dispensed paste by using laser unit. Of course, the process needs some pseed optimization. Though, it impressively illustrates the 3-D micro assembling capabillities of our "VICO 520 Laser" system.
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