iPhone 14 Motherboard Separation - What Makes Repair Tougher?
Автор: REWA Technology
Загружено: 2022-09-30
Просмотров: 135464
Описание:
In our last video, we did a teardown on iPhone 14. Today we will show you how to separate and combine the motherboard of iPhone 14. Furthermore, to share motherboard differences and repair difficulties. In summary, the motherboard has big changes in appearance compared with iPhone 13. CPU soldering and desoldering have become more difficult due to the redesign of the logic board and signal board.
*Source: iRepair
Thanks to iRepair for the IC Distribution reference
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