Memory Wars: Why HBM Is the Hottest Commodity in AI | CONNECTED at COMPUTEX/InnoVEX 2025
Автор: CONNECTED on TaiwanPlus
Загружено: 2025-05-25
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What do first-class flights and High Bandwidth Memory (HBM) for AI applications have in common? Everything — and the seats are gone.
At this year’s COMPUTEX/InnoVEX, we sat down with ATP (@Atpincelectronics)’s Jeff Hsieh to discuss how memory technology is adapting to AI, the rise of domain twins in manufacturing and why cross-enterprise data collaboration is the next big shift in industrial AI.
00:00 Importance of memory and storage in AI
02:08 Market volatility and supply-demand cycles
03:20 Memory market: ‘First class is completely sold out’
04:40 Geopolitical pressures on supply chains
06:10 ATP’s agile supply chain strategies
07:41 Taiwan’s role in tech innovation at COMPUTEX 2024
08:05 Defining the AI NEXT theme
09:24 How ATP uses AI for business optimization
11:54 Balancing innovation, data ethics and security
12:12 Future of collaborative AI in B2B
#AIMemory #HBM #COMPUTEX
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