A Giant Leap in Interconnect Technology: Next Gen VITA 100
Автор: TE Connectivity
Загружено: 2026-02-09
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With advances in silicon packages, there is a need to accommodate increased power consumption, higher pin counts and higher data rates while maintaining a smaller footprint. These requirements will be a challenge when implementing OpenVPX in next generation systems. In this presentation, we discuss advances in interconnect for tomorrow’s embedded systems and preview the next generation connector – with increased pin count, data rates, and capacity – selected for VITA 100 architecture.
Learn More:https://www.te.com/en/industries/defe...
ABOUT TE CONNECTIVITY
TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal, and data to advance next-generation transportation, renewable energy, automated factories, data centers, medical technology, and more. Learn more at www.te.com
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