Design Integration: Advanced Packaging Design Platform and Assembly Design Kit for Chiplets and...

Описание: Road to Chiplets - Design Integration
Advanced Packaging Design Platform and Assembly Design Kit for Chiplets and Heterogeneous Integration
Lihong Cao
ASE

Lihong Cao
ASE

Chiplets or die partitioning offers a compelling value proposition for yield improvement, IP reuse, performance and cost optimization. Advanced packaging technologies such as 2.5D Si TSV interposer, Fanout RDL interposer and 3D hybrid bonding packaging have been developed for chiplets and system heterogeneous integrations to fulfil the continuous pursuit of higher performance, higher bandwidth and lower power consumption at a more manageable cost. However, the chiplets integration solutions especially for HPC, Networking, AI and Edge computing applications have also urged the demands for advanced packages with higher density interconnects and larger footprint body sizes. The package layout density can reach tens or even hundreds of times than that of conventional FCBGA packages. High density and complex connectivity in advanced packaging cause more difficulties and challenges by using traditional EDA tool for packaging design and assembly manufacturing validation.

In this presentation, a new design flow and platform for advanced high density package design were introduced. The design platform was used to complete the routings of ultra-high density I/O such as the Si interposer MEOL (Middle End of Line) and Fan-Out RDL interposer. Compared with the traditional design platform, it had reduced the design cycle time and improved the design accuracy. In addition, this presentation also introduced Assembly Design Kit (ADK) to provide the new design rule checking (DRC and LVS) and procedure to the IC or system designers. It also demonstrated how DRC tools playing an important role in RDL process improvement. Finally, from OSATs perspective, the design challenges and collaboration with system and IC design companies on chiplets integration were also elaborated.