Integrated Power and Precision Cooling for 800 VDC Architecture
Автор: Open Compute Project
Загружено: 2025-10-22
Просмотров: 833
Описание:
Simon Ong GM - Liteon
The Next Generation Rack Solution push data center design to new extremes – 600 kW power density, full liquid cooling, and ultra-dense mechanical configurations. The Next Generation Rack architecture demand hardware solutions that transcend todays power, cooling, and mechanical limits. In this session, LITEON will present how its Level 9 solution with an 800 VDC power system addresses the core challenges. We will share technical insights into architectural trade-offs, reliability validation for greater than 144NVL systems, and innovations in rack-level integration that streamline deployment and serviceability. LITEONs solutions are enabling The Next Generation Racks to meet the demands of next-generation AI infrastructure.
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