Manual CVL Lamination and Alignment for Flexible PCBs

Описание: Coverlay (CVL) lamination is a fundamental process in protecting flexible circuit traces from environmental exposure and electrical interference. This stage involves the precise alignment and tacking of a polyimide-based dielectric layer onto the etched copper substrate. Manual alignment is utilized to ensure exact registration over complex circuit geometries and high-density pad openings.

Correct manual positioning is critical for maintaining access to solderable surfaces while ensuring complete encapsulation of the conductive traces. Following the initial manual tacking, the assembly undergoes a thermal vacuum pressing cycle to achieve a permanent, void-free bond. This process ensures the mechanical flexibility and long-term insulation reliability of the final flexible printed circuit.

Juniper Flex PCBs specializes in high-performance flex and rigid-flex manufacturing with the following core advantages:

Large-size flex PCB up to 610 × 900 mm
Ultra-long flex PCB up to 7000 mm / 100 meters
Roll-to-roll flex PCB production for efficient mass manufacturing
mSAP bump PCB capability for advanced packaging requirements
Ultra-thin rigid PCB for space-constrained designs
Ultra-fine flex PCB for high-density circuitry
Large-size rigid PCB for oversized layouts

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