Tackling Power, Heat, and Scale with Flex’s Next-Gen Data Center Solutions
Автор: Open Compute Project
Загружено: 2025-10-22
Просмотров: 184
Описание:
Brandon Weilbacher Senior Director, Technology Strategy - Flex, Paul Diemer Chief Technology Officer, Embedded and Critical Power - Flex (Flextronics)
Demand for AI-driven compute is creating unprecedented challenges in power, heat, and scale for data center operators. As they navigate growing technical complexity, rising power and thermal demands, and accelerated build timelines, companies are turning to Flex to stay ahead. Flexs portfolio spans 80% of the data center, speeding the deployment of next-generation infrastructure through advanced manufacturing, innovative products, and end-to-end services. This session will highlight Flexs latest integrated technology solutions for next-generation data centers, announced at OCP, including
· Pre-fabricated modular power and IT data center solutions to expedite deployment and reduce supply chain complexity
· Fully integrated system rack designs and advanced manufacturing capabilities for seamless deployment at scale
· Advanced power and liquid cooling products from grid to chip
· Specialized data center services that optimize and streamline the entire product lifecycle
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