Liquid Metal Failure: Improper Removal Caused LM to Seep Under CPU | Geld Technologies
Автор: GELD TECHNOLOGIES
Загружено: 2026-01-16
Просмотров: 15
Описание:
This video documents a real case of improper liquid metal (LM) removal handled prior to arriving at Geld Technologies.
As shown, the liquid metal has migrated underneath the CPU, which is a serious red flag and indicates incorrect removal technique. When liquid metal is not properly controlled during removal, it can flow under the CPU package and into surrounding areas.
⚠️ Why this is dangerous:
Liquid metal is electrically conductive. Once it migrates under the CPU, it can cause:
Short circuits
Corrosion over time
Permanent CPU or motherboard damage
This typically happens due to:
Poor removal technique
Excessive pressure during cleaning
No masking or insulation of surrounding components
Lack of experience handling liquid metal
🔧 Professional note from Geld Technologies:
Liquid metal should only be applied and removed by trained technicians using proper insulation, controlled absorption, and inspection methods. Improper handling can easily turn a thermal upgrade into a board-level failure.
This video is shared for educational purposes to help users and technicians understand the risks involved.
📍 If you’re unsure—don’t DIY liquid metal.
Have it handled by professionals.
📞 Need Professional Help?
If your device has liquid metal issues, overheating, or suspected board damage:
👉 WhatsApp: https://wa.me/60166669438
👉 Website: https://www.computerrepair.com.my
📍 Geld Technologies – Professional Laptop & Motherboard Repair (Malaysia)
Over a decade of experience handling advanced thermal and board-level repairs.
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